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💻 IC Reballing Plate Stencil: Precision BGA Repair

Are you a professional technician or a serious electronics hobbyist looking for the perfect tool to perform reliable BGA reballing?

Our IC Reballing Plate Stencil provides the accuracy and durability you need to flawlessly restore or replace Ball Grid Array (BGA) integrated circuits. This is an indispensable tool for repairing devices such as mobile phones, tablets, laptops, and game consoles where micro-soldering is required.

✨ Key Features & Benefits:

High Precision Alignment: Laser-cut openings guarantee perfect alignment with the IC solder pads, ensuring every solder ball is placed correctly for a strong, reliable connection.

Durable & Long-Lasting: Constructed from high-quality, heat-resistant stainless steel, this stencil is designed to withstand repeated use under high temperatures without warping or deforming.

Thin & Flexible Design: The optimal thickness allows for easy application of solder paste while remaining flexible enough to conform gently to the IC's shape without damaging delicate components.

Essential for BGA Repair: A crucial component in the reballing process, enabling the uniform application of new solder balls onto IC chips after removal and cleaning.

Universal or Specific Compatibility: (Note: Choose one based on your specific product:)

Universal: Designed to work with a wide range of common BGA chip footprints.

Specific: Perfectly matched for [Mention specific chip model, e.g., A12/A13/A14 CPU] chips.

🛠️ How it Works:

Secure the BGA chip in a reballing jig or holder.

Place the appropriate IC Reballing Plate Stencil over the chip.

Apply solder paste uniformly across the stencil openings.

Remove the stencil and use a hot air station to reflow the solder paste, forming perfect, uniform solder balls on the IC pads.

Get the professional results your repairs demand. Add the IC Reballing Plate Stencil to your toolkit today!